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Vincotech-采用IGBT M7芯片技术的flow E1/E2,实现更高
作者:admin 发布时间:2019-08-06 10:54

Vincotech最新发布的flow E1/E2系列模块,具有优异的热性能,并采用最新一代IGBT M7芯片技术,可帮助客户提高效率,同时减少供应链问题。了解功率范围扩展至50 A(PIM)和100 A(sixpack)的新型PIM(CIB)和sixpack配置。

 

 

主要优势

 

  • 与业内其他同类产品相比,热性能(Rth(j-s))提升20%,使用寿命更长,功率和可靠性更高 

  • 25A PIM等采用 flow E1小型封装,功率密度更高

  • 真正的芯片级多重采购,可增强供应链的安全性 

  • 采用预涂相变材料和压接引脚,可轻松组装 

     

 

 

特性 

主要封装特性:

  • 12mm低寄生感应标准工业封装

  • 预弯DCB可与散热器发生良好的热接触

  • CTI 600 封装材料

  • 压接引脚带泄压区 

  • 可选相变材料

 

主要电气特性:

  • 超低通态压降Vce(sat)

  • 优化的动态损耗

  • 续流管特性更软

  • dV/dt 可控性增强

 

输出功率损耗基准测试对比

下方图表比较了在最大允许结温150°C时的输出功率,开关频率范围为2到16 kHz。对flowPIM E2 1200 V / 25 A模块和其他同类产品的等效模块进行了基准测试。该基准测试显示,采用IGBT M7的新型flowPIM E2的输出功率提高了15%,超越了其他同类产品。

【输出功率损耗与开关频率在最大允许结温为150°C(fout = 50Hz,Tsink = 80°C,Vout = 340 V)时的基准测试对比结果】

 

(点击查看高清图片)

 

想要了解flow E系列产品的更多详情,请访问 https://www.vincotech.com/flow-E1+E2/

 

(翻译校对:Warren Wang, 责任编辑:Anna Chai)

 

 

 

flow E1/E2 WITH IGBT M7 FOR HIGHER POWER DENSITY

New flowPIM & flowPACK E1/E2 with IGBT M7 are available now and ready to ship.

 

Featuring superior thermal performance and the latest-generation IGBT M7 chip technology, these new modules provide customers with enhanced efficiency while reducing supply chain issues. Discover the new PIM (CIB) and sixpack configurations with the power range extending up to 50 A (PIM) and 100 A (sixpack).

 

 Benefits

  • 20 % better thermal performance (Rth(j-s)) than  the competition for extended life, more power, and greater reliability 

  • Smaller packages such as the 25 A PIM in flow E1  for higher power density 

  • Real multiple source down to chip level for enhanced  supply chain security 

  • Easy assembly with pre-applied phase-change  material and Press-fit pins

 

Features 

Key housing features:

  • 12 mm low-inductive standard industrial package

  • Pre-bent DCB for excellent thermal contact to heat sink

  • CTI 600 housing material

  • Press-fit pins with stress-relive zone

  • Optional Phase-change material

 

 

Key electrical features:

  • Lowest on-stage voltage Vce(sat)

  • Optimized dynamic losses

  • Improved FWD softness

  • Enhanced dV/dt controllability

 

 

 

Output power losses benchmark 

 

The chart compares output power at the maximum allowed Ttemperature of 150°C at switching frequencies ranging from 2 to 16 kHz. The flowPIM E2 1200 V/25 A module and a competitor’s equivalent module were benchmarked to this end. This bench test revealed that the new flowPIM E2 featuring the IGBT M7 outperforms the competition by delivering up to 15% higher output power.

【Output power losses vs. fsw benchmarked at maximum allowed Tj temperature of 150°C (fout=50Hz, Tsink=80°C, Vout=340 V)】

 

To learn more about the new about our flow E product family, please visit https://www.vincotech.com/flow-E1+E2/

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